Innovation Mission Germany: integrated photonics and advanced packaging

General event

Are you active in the field of integrated photonics and/or advanced packaging and heterogeneous integration? And would you like to gain insight into research collaborations and business opportunities? Then join the innovation mission to Germany from September 28 to October 2, 2026.

During the innovation mission, we will visit leading players in semiconductors, integrated photonics, and advanced packaging/heterogeneous integration in Germany. We will engage in discussions with companies, knowledge institutions, and regional clusters in Saxony and Berlin-Brandenburg. We will also explore opportunities for entry into German end markets. This will provide you with insight into relevant projects, new research collaborations, and business opportunities for your organization.

For whom?

The innovation mission is intended for professionals from industries and knowledge institutions working on semiconductors and integrated photonics. 

Goals of the mission

The innovation mission has the following goals:

  • Increasing engagement between the two technology worlds of semiconductors and photonics, with a focus on bringing together companies and knowledge institutions. The aim of this is to further explore and develop concrete projects and research collaborations. 
  • Exploring collaboration opportunities with major German projects currently in the start-up phase, such as the APECS Fraunhofer Pilot Line.
  • Exploring opportunities for the Dutch industry to enter end markets.

Participation :

  • Participation costs €350 excluding VAT per person.
  • Register by May 22, 2026